Enhanced thermal management in high-power electronics using phase change materials
AssigneeConnaught Electronics Ltd.
InventorsAndrew DRAPER, Roman RODRICKSELVARAVI, Basheerahmed SHIHABUDEEN, Jerin WILLIAM JAMES
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Abstract
A thermal management system for vehicle electronics addresses challenges of fail-safe cooling in high-power electronic systems. The system includes printed circuit boards (PCB) with a heat-generating components. A phase change material (PCM) absorbs heat generated by the heat-generating component, providing a thermal buffer during coolant system failures. The PCM can be provided in various locations and configurations, such as on an opposing side of the PCB from the heat-generating component, within the fluid channels themselves or remotely situated on a heat-spreader.
Claims20
A thermal management system for vehicle electronics, the thermal management system comprising:
- a printed circuit board (PCB) having an upper side and a lower side;
- a heat-generating component having an upper side and a lower side, wherein the upper side of the heat-generating component is mounted on the lower side of the PCB;
- and
- a phase change material (PCM) positioned on the upper side of the PCB at a location that is vertically aligned with the heat-generating component, wherein the PCM absorbs heat conducted through the PCB from the heat-generating component such that the PCM is configured to protect the heat-generating component upon failure of a separate cooling system.
A thermal management system for vehicle electronics, the thermal management system comprising:
- a printed circuit board (PCB) having an upper side and a lower side;
- a heat-generating component having an upper side and a lower side, wherein the upper side of the heat-generating component is mounted on the lower side of the PCB;
- a heat sink contacting the lower side of the heat-generating component, wherein the heat sink defines cooling channels beneath the heat-generating component, wherein the cooling channels are configured to facilitate the flow of coolant directly underneath the heat-generating component to absorb and dissipate heat generated by the heat-generating component;
- and
- a phase change material (PCM) embedded in the heat sink such that the PCM is configured to protect the heat-generating component upon failure of a separate cooling system.
A thermal management system for vehicle electronics, the thermal management system comprising:
- a printed circuit board (PCB) having an upper side and a lower side;
- a housing located beneath the PCB and defining a cavity therebetween;
- a heat-generating component located within the cavity and mounted on the lower side of the PCB;
- a first phase change material (PCM) located between the housing and the PCB;
- and
- a plurality of heat pipes connecting the heat-generating component to the first PCM, each heat pipe has a first end connected to the heat-generating component and a second end connected to the first PCM, wherein the plurality of heat pipes contain a second PCM.
Dependencies are inferred from the claim text.