Dissipation of heat through keyboard using a heat pipe

An apparatus for removing heat from an integrated circuit mounted on a first surface of a circuit board, comprising:

• a region of said circuit board defining a plurality of apertures thermally coupled to said integrated circuit, said plurality of apertures extending from said first surface to a second surface of said circuit board, said region at least partially filled by material with a higher thermal conductivity than said circuit board;
• a heat conducting mass coupled to said second surface of said circuit board and thermally engaging said plurality of apertures;
• a heat pipe thermally coupled to said heat conducting mass;
• and
• a heat dissipation plate affixed substantially beneath and parallel to a keyboard, said heat dissipation plate thermally coupled to said heat pipe.

A method of cooling an integrated circuit in a computer including a keyboard, comprising the steps of:

• (A) forming a first assembly by
• (1) providing a circuit board;
• (2) forming a first set and a second set of apertures in said circuit board, said first set of apertures disposed within a region;
• (3) applying a thermally conductive material to said region partially filling said first set of apertures;
• (4) attaching said integrated circuit to said circuit board;
• (B) forming a second assembly by
• (1) connecting a heat pipe to a metal electromagnetic interference shield;
• (2) affixing said heat pipe to a heat conducting block;
• and
• (C) coupling said first assembly to said second assembly by coupling said heat conducting block to said circuit board thermally engaging said heat conducting block and said first set of apertures;
• and
• (D) affixing the metal electromagnetic shield beneath and substantially parallel to a keyboard.

A method of cooling an integrated circuit mounted on a first surface of a circuit board in a computer including a keyboard, comprising the steps of:

• (a) transferring heat from said integrated circuit mounted on said first surface of said circuit board through a plurality of thermal vias to a second surface of said circuit board;
• (b) transferring said heat from said plurality of thermal vias to a mass;
• (c) transferring heat from said mass to a plate affixed substantially beneath and parallel to said keyboard;
• and
• (d) dissipating said heat from said plate beneath said keyboard.