H05K 2201/062
Means for thermal insulation
Official title: Means for thermal insulation, e.g. for protection of parts
H05K2201/062 (Means for thermal insulation) appears on 195 US grants and 210 published applications in this corpus.
Search patents in H05K- Granted patents
- 195
- Published applications
- 210
- Assignees
- 172
- Inventors
- 569
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 6 | 10 |
| 2003 | 10 | 9 |
| 2004 | 2 | 11 |
| 2005 | 4 | 12 |
| 2006 | 9 | 10 |
| 2007 | 4 | 16 |
| 2008 | 10 | 13 |
| 2009 | 6 | 8 |
| 2010 | 12 | 8 |
| 2011 | 8 | 15 |
| 2012 | 11 | 4 |
| 2013 | 3 | 5 |
| 2014 | 3 | 5 |
| 2015 | 5 | 11 |
| 2016 | 9 | 7 |
| 2017 | 5 | 5 |
| 2018 | 7 | 6 |
| 2019 | 7 | 7 |
| 2020 | 5 | 9 |
| 2021 | 6 | 9 |
| 2022 | 7 | 2 |
| 2023 | 7 | 6 |
| 2024 | 1 | 8 |
| 2025 | 5 | 10 |
| 2026 | 5 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heat dissipating assembly for circuit15 Sep 2026US 12,739,964 B2Schneider Electric (China) Co., Ltd.
- Structural enclosure for protection against foreign object debris and restraint of thermal interface material15 Sep 2026US 12,739,978 B2Raytheon Company
- Sensor node thermal management and illumination18 Aug 2026US 12,710,318 B2Dwellwell Analytics, Inc.
- Circuit board with embedded elements and method for fabricating the same26 May 2026US 12,641,730 B2Boardtek Electronics Corporation
- Thermally decoupled signal transmission lines19 May 2026US 12,635,066 B2International Business Machines Corporation
- Power modules with enhanced thermal conductivity11 Jun 2026US 2026/0164537 A1Analog Devices, Inc.
- Multilayer body and method for producing same21 May 2026US 2026/0143582 A1Teijin Limited
- Coating agent and electronic component module manufacturing method9 Apr 2026US 2026/0101430 A1Sekisui Chemical Co., Ltd.
- Circuit board with embedded elements and method for fabricating the same20 Nov 2025US 2025/0358936 A1Boardtek Electronics Corporation
- Liquid cooled network-interface controller (nic) assembly2 Oct 2025US 2025/0311085 A1
Most cited
By later US patents
- Method of controlling solder ball size of BGA IC components152US 5,519,580 AIntel Corporation · 1996
- Components with conductive solder mask layers133US 6,329,605 B1Tessera, Inc. · 2001
- Printed wiring board and electronic device using same90US 5,844,782 ASony Corporation · 1998
- Printed circuit board or card thermal mass design60US 5,363,280 AInternational Business Machines Corporation · 1994
- Multilayered printed circuit board and manufacturing method thereof56US 8,148,643 B2Ibiden Co., Ltd. · 2012