Printed wiring board and electronic device using same
AssigneeSony Corporation
InventorHiroyuki Fukasawa
Life of this patent
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AssigneeSony Corporation
InventorHiroyuki Fukasawa
Estimating the term…
A printed wiring board and an electronic device using the same with which the formation of cracks in base portions of projecting external electrodes formed on lands on the printed wiring,board is certainly prevented. With respect to a printed wiring board 11 having lands 16 formed in a wiring pattern where external electrodes 13 are to be formed and a pattern-protecting film 17 having openings 17a where the external electrodes 13 are to be formed, the opening diameter D1 of the openings 17a in the pattern-protecting film 17 is set greater by a predetermined dimension than the external diameter D2 of the lands 16 and a gap is thereby provided between each of the external electrodes 13 and the pattern-protecting film 17 so that the external electrodes 13 and the pattern-protecting film 17 do not make contact with each other and as a result there is no cracking of the external electrodes 13 caused by differential thermal expansion of the external electrodes 13 and the pattern-protecting film 17. An electronic module comprising the electronic device of the invention mounted on a mother board can be widely used by being incorporated into various types of electronic equipment.
A printed wiring board comprising a land formed on a first side of the wiring board and a pattern-protecting film formed on the first side wherein there is a gap between the pattern protecting film and the land and further wherein the pattern protecting film is at least substantially uniformly spaced apart from and at least substantially surrounding the land.
An electronic device comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.