Components with conductive solder mask layers
AssigneeTessera, Inc.
InventorsMasud Beroz, Belgacem Haba
Life of this patent
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Abstract
A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in proximity to the pads but spaced from said pads. The non-wettable surface of the potential plane element may include a metal such as nickel or a metal oxide. The potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element.
Claims11
A component for forming solder connections comprising a dielectric base having a non solder-wettable surface, a plurality of solder-wettable electrically conductive pads exposed to said non solder-wettable surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying said non solder-wettable surface of said base, said potential plane element having a plurality of openings therein, said at least some of said plurality of pads being exposed through at least some of said plurality of openings, said at least some of said plurality of openings being surrounded by said non solder-wettable surface of said potential plane element so as to confine solder flow proximate to said at least some of said plurality of pads.
A component for forming solder connections comprising a dielectric base having a non solder-wettable surface, a plurality of solder-wettable electrically conductive pads exposed to said non solder-wettable surface, and an electrically conductive potential plane element overlying said non solder-wettable surface of said base, said potential plane element having a plurality of openings therein, said at least some of said plurality of pads being exposed through at least some of said plurality of openings, wherein said potential plane element includes a metallic element and a non solder-wettable surface integral with said metallic element.
Dependencies are inferred from the claim text.