Power modules with enhanced thermal conductivity
AssigneeAnalog Devices, Inc.
InventorsVikas Paduvalli, Hien Minh Pham
Life of this patent
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Abstract
Power modules with enhanced thermal conductivity are disclosed herein. In certain embodiments, a power module includes a circuit board, an inductor component attached to a first or top side of the circuit board, and a semiconductor die attached to a second or bottom side of the circuit board opposite the first side. The power module further includes a thermally conductive wrap at least partially around a dielectric body of the inductor component. The thermally conductive wrap serves to transfer heat from the semiconductor die to a cold plate or heat sink that can be attached to the inductor component opposite the circuit board.
Claims20
A power module comprising:
- a circuit board having a first side and a second side opposite the first side;
- an inductor component attached to the first side of the circuit board, the inductor component having a dielectric body;
- a semiconductor die attached to the second side of the circuit board;
- and
- a thermally conductive wrap at least partially around the dielectric body of the inductor component, the thermally conductive wrap including a first portion between the dielectric body and the circuit board.
A power regulation system comprising:
- a customer board;
- and
- a power module attached to the customer board, the power module comprising:
- a circuit board having a first side and a second side opposite the first side;
- an inductor component attached to the first side of the circuit board, the inductor component having a dielectric body;
- a semiconductor die attached to the second side of the circuit board;
- and
- a thermally conductive wrap at least partially around the dielectric body of the inductor component, the thermally conductive wrap including a first portion between the dielectric body and the circuit board.
A method of assembling a power module, the method comprising:
- wrapping a thermally conductive wrap at least partially around a dielectric body of an inductor component;
- attaching the inductor component to a first side of a circuit board, the thermally conductive wrap including a first portion between the dielectric body and the circuit board;
- and
- attaching a semiconductor die to a second side of the circuit board opposite the first side.
Dependencies are inferred from the claim text.