Circuit board with embedded elements and method for fabricating the same

A method for fabricating a circuit board with embedded elements, comprising:

• providing a conductive structure, and the conductive structure has a trench;
• disposing an electronic component inside the trench of the conductive structure;
• disposing a thermoplastic insulation layer on the conductive structure after the electronic component is disposed inside the trench, so that the thermoplastic insulation layer covers the electronic component and the trench, wherein a heat deflection temperature of the thermoplastic insulation layer is between 376° C. and 410° C.;
• providing an initial circuit substrate;
• disposing the conductive structure inside the initial circuit substrate after the thermoplastic insulation layer is disposed on the conductive structure, wherein a first surface of the thermoplastic insulation layer is exposed on a second surface of the initial circuit substrate, and the first surface is flush with the second surface;
• and
• patterning a first metal layer of the initial circuit substrate to form a circuit layer after the conductive structure is disposed inside the initial circuit substrate, and a circuit substrate is formed from the initial circuit substrate.