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US 2026/0313782 A1Published application
Microfluidic printed circuit board cooling
AssigneeMicrosoft Technology Licensing, LLC
InventorsShubhangi TEWARI, Bharath RAMAKRISHNAN
Life of this patent
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Abstract
A microfluidic printed circuit board (PCB) including: a plurality of layers; a heat-generating component attached to the microfluidic PCB; and a network of microfluidic passages applied to one or more of the plurality of layers and in thermally conductive contact with the heat-generating component, the network of microfluidic passages electrically isolated from traces of one or more of the plurality of layer
Claims20
A microfluidic printed circuit board (PCB) comprising:
- a plurality of layers;
- a heat-generating component attached to the microfluidic PCB;
- and
- a network of microfluidic passages applied to one or more of the plurality of layers and in thermally conductive contact with the heat-generating component, the network of microfluidic passages electrically isolated from traces of one or more of the plurality of layers.
1 more element
A method of manufacturing a microfluidic printed circuit board (PCB) comprising:
- providing a top layer including a top network of traces;
- attaching a first mid-layer including a first middle network of traces;
- attaching a second mid-layer including a second middle network of traces;
- attaching a bottom layer including a bottom network of traces, wherein the top layer, the first mid-layer, the second mid-layer, and the bottom layer are each one of a plurality of layers;
- attaching a heat-generating component to the microfluidic PCB;
- and
- applying a network of microfluidic passages to one or more of the plurality of layers and in thermally conductive contact with the heat-generating component, the network of microfluidic passages electrically isolated from the top, first middle, second middle, and bottom traces.
4 more elements
A printed circuit board comprising:
- a plurality of layers;
- a heat-generating component attached to the printed circuit board;
- a closed-loop network of microfluidic passages applied to one or more of the plurality of layers and in thermally conductive contact with the heat-generating component, the network of microfluidic passages electrically isolated from traces of one or more of the plurality of layers;
- and
- a microfluidic pump placed within the closed-loop network and attached to the printed circuit board, the microfluidic pump to circulate a coolant fluid through the network of microfluidic passages to cool the heat-generating component.
2 more elements
Dependencies are inferred from the claim text.