H05K 2201/064
Fluid cooling
Official title: Fluid cooling, e.g. by integral pipes
H05K2201/064 (Fluid cooling) appears on 322 US grants and 509 published applications in this corpus.
Search patents in H05K- Granted patents
- 322
- Published applications
- 509
- Assignees
- 257
- Inventors
- 1,057
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 4 |
| 2003 | 3 | 2 |
| 2004 | 4 | 3 |
| 2005 | 3 | 6 |
| 2006 | 10 | 17 |
| 2007 | 8 | 8 |
| 2008 | 3 | 16 |
| 2009 | 9 | 8 |
| 2010 | 5 | 6 |
| 2011 | 6 | 6 |
| 2012 | 4 | 5 |
| 2013 | 3 | 6 |
| 2014 | 4 | 8 |
| 2015 | 10 | 6 |
| 2016 | 8 | 13 |
| 2017 | 10 | 15 |
| 2018 | 7 | 15 |
| 2019 | 25 | 22 |
| 2020 | 23 | 36 |
| 2021 | 31 | 23 |
| 2022 | 25 | 34 |
| 2023 | 26 | 26 |
| 2024 | 23 | 30 |
| 2025 | 29 | 39 |
| 2026 | 15 | 155 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic assembly and semiconductor switching device18 Aug 2026US 12,713,514 B2Siemens Aktiengesellschaft
- Torso of a humanoid robot11 Aug 2026US 12,707,556 B1Figure Ai Inc.
- Coolant flow control11 Aug 2026US 12,707,604 B1Auradine, Inc.
- Two phase shower immersion cooling system for data center: microstructure28 Jul 2026US 12,696,376 B2Jemm's Labs
- Electronic controller unit28 Jul 2026US 12,696,425 B2Aptiv Technologies AG
- Enhanced thermal management in high-power electronics using phase change materials8 Oct 2026US 2026/0313780 A1Connaught Electronics Ltd.
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Systems and methods for leakage protection1 Oct 2026US 2026/0299655 A1Quanta Computer Inc.
- Thermal cooling solutions for variable height devices in an optical modem clamshell assembly1 Oct 2026US 2026/0304592 A1Ciena Corporation
- Circuit board and electrical device having the same1 Oct 2026US 2026/0304594 A1Pegatron Corporation
Most cited
By later US patents
- Foldable electronic assembly module210US 5,224,023 A1993
- Dissipation of heat through keyboard using a heat pipe114US 5,513,070 AIntel Corporation · 1996
- Power semiconductor package having integral fluid cooling82US 7,538,425 B2Delphi Technologies, Inc. · 2009
- Fluid-cooled module for integrated circuit devices81US 9,510,479 B2Lockheed Martin Corporation · 2016
- Heat pipe thermal mounting plate for cooling electronic circuit cards80US 4,118,756 AHughes Aircraft Company · 1978