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US 7,538,425 B2Granted
Power semiconductor package having integral fluid cooling
AssigneeDelphi Technologies, Inc.
InventorsBruce A. Myers, Darrel E. Peugh, Lester Wilkinson, Erich W. Gerbsch
Life of this patent
Estimating the term…
Abstract
A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.
Claims7
A semiconductor package, comprising:
- a circuit board having inlet and outlet fluid conduits formed therein;
- a first substrate supported on said circuit board;
- a semiconductor device including a semiconducting silicon chip supported on a first major surface of said substrate opposite said circuit board and defining at least one conductor pad thereon;
- a set of micro-channels form in said semiconducting silicon chip, said micro-channels opening toward said first major surface;
- and
- a fluid manifold formed in said semiconducting silicon chip in circuit with said set of micro-channels, said first substrate including a fluid inlet coupled to said fluid manifold at a first end of said set of micro-channels for delivering coolant fluid from said inlet conduit to said micro-channels, and a fluid outlet coupled to said fluid manifold at a second end of said set of micro-channels opposite said first end for exhausting said coolant fluid from said micro-channels to said outlet conduit, said fluid inlet extending through said substrate and coupled with said circuit board inlet fluid conduit and said fluid outlet extending through said substrate and coupled with said circuit board outlet fluid conduit;
- wherein said first substrate is supported on said circuit board to which terminals of said semiconductor device are attached, and
- wherein said fluid inlet comprises a series of openings formed in said substrate and opening into said fluid manifold,
- said semiconductor package further comprising a plate joined to a second major surface of said first substrate opposite said first major surface with an intervening metallization layer defining a fluid plenum that couples said fluid conduit to said series of openings.
6 more elements
A semiconductor package, comprising:
- a circuit board having inlet and outlet fluid conduits formed therein;
- a first substrate supported on said circuit board;
- a semiconductor device including a semiconducting silicon chip supported on a first major surface of said substrate opposite said circuit board and defining at least one conductor pad thereon;
- a set of micro-channels form in said semiconducting silicon chip, said micro-channels opening toward said first major surface;
- a fluid manifold formed in said semiconducting silicon chip in circuit with said set of micro-channels, said first substrate including a fluid inlet coupled to said fluid manifold at a first end of said set of micro-channels for delivering coolant fluid from said inlet conduit to said micro-channels, and a fluid outlet coupled to said fluid manifold at a second end of said set of micro-channels opposite said first end for exhausting said coolant fluid from said micro-channels to said outlet conduit, said fluid inlet extending through said substrate and coupled with said circuit board inlet fluid conduit and said fluid outlet extending through said substrate and coupled with said circuit board outlet fluid conduit;
- a second substrate attached to said semiconductor device opposite said first substrate:
- a second set of parallel micro-channels formed in said second substrate;
- a second fluid manifold surrounding said second set of micro-channels;
- a second fluid inlet coupled to said second fluid manifold at a one end of said second set of micro-channels for delivering coolant fluid thereto, and a second fluid outlet coupled to said second fluid manifold at the other end of said second set of micro-channels for exhausting said coolant fluid therefrom.
6 more elements
Dependencies are inferred from the claim text.