Fluid-cooled module for integrated circuit devices

A closed-loop fluid-cooled electronic module, comprising:

• a printed wiring board (PWB) incorporating PWB electrical circuitry;
• a plurality of interposers including a first interposer and a second interposer;
• said first interposer being mounted on said printed wiring board, said first interposer having a first interposer cooling fluid channel for circulating a cooling fluid therethrough and being provided with first interposer electrical wiring in electrical communication with said PWB electrical circuitry of said printed wiring board;
• said second interposer having a second interposer cooling fluid channel for circulating the cooling fluid therethrough and being provided with second interposer electrical wiring in electrical communication with said PWB electrical circuitry of said printed wiring board;
• a first electronic or electro-optical device provided in heat-transmissive contact with said first interposer and in electrical communication with said first interposer electrical wiring;
• a heat exchanger having a heat exchanger cooling fluid channel for circulating said cooling fluid therethrough;
• a pump mounted on said printed wiring board or said first interposer to circulate said cooling fluid through said first interposer cooling fluid channel, said second interposer cooling fluid channel, and said heat exchanger cooling fluid channel;
• said first interposer, said second interposer, said heat exchanger, and said pump being configured to circulate said cooling fluid through said first interposer cooling fluid channel, said second interposer cooling fluid channel, and said heat exchanger cooling fluid channel in a closed-loop fluid cooling path providing fluid serial communication between components of said electronic module, said components including said first interposer, said second interposer, said heat exchanger, and said pump;
• said second interposer being arranged such that said second interposer is in heat-transmissive contact with a second electronic or electro-optical device, the second electronic or electro-optical device being in heat-transmissive contact with said first electronic or electro-optical device;
• and
• said heat exchanger being mounted on said second interposer.

A closed-loop fluid-cooled electronic module, comprising:

• a printed wiring board (PWB) incorporating PWB electrical circuitry;
• a plurality of interposers including a first interposer and a second interposer;
• said first interposer being mounted on said printed wiring board, said first interposer having a first interposer cooling fluid channel for circulating a cooling fluid therethrough and being provided with first interposer electrical wiring in electrical communication with said PWB electrical circuitry of said printed wiring board;
• said second interposer having a second interposer cooling fluid channel for circulating the cooling fluid therethrough and being provided with second interposer electrical wiring in electrical communication with said PWB electrical circuitry of said printed wiring board;
• a first electronic or electro-optical device provided in heat-transmissive contact with said first interposer and in electrical communication with said electrical wiring of said first interposer;
• a heat exchanger having a heat exchanger cooling fluid channel for circulating said cooling fluid therethrough;
• a pump mounted on said printed wiring board or said first interposer to circulate said cooling fluid through said first interposer cooling fluid channel, said second interposer cooling fluid channel, and said heat exchanger cooling fluid channel;
• said first interposer, said second interposer, said heat exchanger, and said pump being configured to circulate said cooling fluid through said first interposer cooling fluid channel, said second interposer cooling fluid channel, and said heat exchanger cooling fluid channel in a closed-loop fluid cooling path providing fluid serial communication between components of said electronic module, said components including said first interposer, said second interposer, said heat exchanger, and said pump;
• said first electronic or electro-optical device being mounted on said first interposer in heat-transmissive contact therewith;
• said second interposer being mounted in heat transmissive contact with said first electronic or electro-optical device;
• a second electronic or electro-optical device mounted on said second interposer in heat-transmissive contact therewith;
• and
• said second electronic or electro-optical device also being in heat-transmissive contact with said heat exchanger.

A fluid-cooled electronic or electro-optical module, comprising:

• a plurality of interposers including a first interposer and a second interposer, each of the interposers including interposer electrical circuitry and a cooling fluid channel and each having first and second sides;
• a plurality of micro-electronic or electro-optical devices arranged in a plurality of stacked arrangements such that a first device and a second device of the micro-electronic or electro-optical devices are arranged such that the first and second devices are each in direct contact with the first side of the first interposer, and a third device and a fourth device of the micro-electronic or electro-optical devices are arranged such that the third and fourth devices are each in direct contact with the second side of the second interposer which faces the first side of the first interposer;
• a pump that is not mounted on any of the interposers;
• a heat exchanger;
• an electronic or electro-optical connector configured to releasably attach said electronic or electro-optical module to a mounting chassis such that in an attached state, said mounting chassis is operable to connect said module to at least one of an electronic path, an electro-optical path, or a thermal transfer path provided by said mounting chassis;
• and
• a closed-loop fluid cooling path providing fluid serial communication between components of said module, said components including said first interposer, said second interposer, said heat exchanger, and said pump.