Coolant flow control
AssigneeAuradine, Inc.
InventorGlen Gibson
Life of this patent
Estimating the term…
Abstract
A circuit system includes: a plurality of integrated circuit (IC) chips on a circuit board; a first conduit configured to convey a first flow of a coolant, wherein the first conduit is arranged such that the first flow of the coolant through the first conduit cools the circuit board; a second conduit configured to convey a second flow of the coolant from a common inlet with the first conduit, wherein the second flow bypasses the first conduit; a valve configured to adjust a relative degree of flow of the coolant between the first conduit and the second conduit; and a controller configured to, based at least on data characterizing operation of the plurality of IC chips, control the valve to adjust a first flow rate of the coolant through the first conduit.
Claims18
A circuit system, comprising:
- a plurality of circuit board systems, wherein each circuit board system of the plurality of circuit board systems comprises:
- a circuit board,
- a plurality of integrated circuit (IC) chips mounted on the circuit board,
- a cold plate thermally coupled to the circuit board,
- a first conduit extending through the cold plate, the first conduit configured to convey a flow of a coolant, wherein the first conduit is arranged such that the flow of the coolant through the first conduit is configured to heat and cool the circuit board,
- a valve configured to control a rate of the flow of the coolant through the first conduit,
- a controller configured to:
- receive a first temperature from at least one of the plurality of IC chips,
- based on the first temperature, control the valve to decrease the rate of the flow of the coolant to allow the plurality of IC chips to heat to a target operating temperature range,
- after controlling the valve to decrease the rate of the flow of the coolant, receive a second temperature from the at least one of the plurality of IC chips, wherein the second temperature is greater than the first temperature, and
- based on the second temperature, control the valve to increase the rate of the flow of the coolant to cool the plurality of IC chips and maintain the plurality of IC chips at the target operating temperature range, and
- an enclosure housing the circuit board, the cold plate, and the controller;
- and
- a coolant source configured to supply the coolant to the plurality of circuit board systems in parallel.
Dependencies are inferred from the claim text.