Thermal cooling solutions for variable height devices in an optical modem clamshell assembly

Abstract

An optical modem clamshell assembly including a printed circuit board assembly including at least one component, a top plate, a first floating heatsink disposed between and in thermal communication with a first component and the top plate, where the first floating heatsink is biased away from the top plate to provide a first thermal contact pressure to the first component, and, optionally or alternatively, a second floating heatsink disposed between and in thermal communication with a second component and the top plate, where the second floating heatsink is biased away from the top plate to provide a second thermal contact pressure to the second component. The top plate may include an embedded heatsink, the first floating heatsink may be a vapor chamber, and the second floating heatsink may be a plate with a heat pipe thermally coupled between the floating plate and the top plate remote from the embedded heatsink.

Dependencies are inferred from the claim text.