Electronic device
AssigneeKmw Inc.
InventorsBae Mook Jeong, Kyo Sung Ji, Seong Min Ahn, Chi Back Ryu, Jae Eun Kim, Seung Min Lee, Ki Hun Park, Won Jun Park, Jun Woo Yang
Life of this patent
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AssigneeKmw Inc.
InventorsBae Mook Jeong, Kyo Sung Ji, Seong Min Ahn, Chi Back Ryu, Jae Eun Kim, Seung Min Lee, Ki Hun Park, Won Jun Park, Jun Woo Yang
Estimating the term…
The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.
An electronic device comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.