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US 11,172,580 B2Granted
BGA component masking dam and a method of manufacturing with the BGA component masking dam
AssigneeRosemount Aerospace Inc.
InventorJames R. Gaertner, II
Life of this patent
Estimating the term…
Abstract
The proposed masking dam protects ball grid array integrated circuit components from conformal coating overflow, preventing joint breakage and thermal mismatch. The masking dam includes a frame with an integrated seal, a cover, and a fastening mechanism. The frame is sealed to a circuit board surround a component, the cover is attached to the frame, and the masking dam is secured to protect the component.
Claims17
A masking dam comprising:
- a removable cover configured to protect a component;
- and
- a frame comprising:
- an integrated seal embedded in the frame, the integrated seal configured to sealingly engage the removable cover and a circuit board, wherein the integrated seal resides in a groove on the frame;
- a mounting feature configured to attach the frame to the circuit board;
- and
- a securing feature configured to attach the frame to the removable cover;
- wherein, the frame and the integrated seal are configured to tolerate up to 260 degrees Celsius and the masking dam prevents a conformal coating from flowing underneath the component and bridging between the component and the circuit board when the conformal coating is applied during a circuit board manufacturing process, thereby preventing a coefficient of thermal expansion mismatch between the component and the circuit board and protecting solder joints connecting the component to the circuit board;
- and
- wherein, the removable cover is removed after the conformal coating is applied during the circuit board manufacturing process to permit a heat sink to be attached to a top surface of the component.
7 more elements
A method of protecting a component on a circuit board comprising:
- sealing a frame to the circuit board surrounding the component with an integrated seal embedded in the frame, wherein the frame and the integrated seal are configured to tolerate up to 260 degrees Celsius and the integrated seal resides in a groove on the frame;
- placing a cover onto the frame above the component opposite the circuit board;
- and
- securing the cover to the circuit board with an attachment mechanism wherein the frame, the cover, and the integrated seal are components of a masking dam that prevent a conformal coating from flowing underneath the component and bridging between the component and the circuit board when the conformal coating is applied during a circuit board manufacturing process, thereby preventing a coefficient of thermal expansion mismatch between the component and the circuit board and protecting solder joints connecting the component to the circuit board;
- removing the cover after the conformal coating is applied during the circuit board manufacturing process;
- and
- attaching a heat sink to a top surface of the component.
4 more elements
Dependencies are inferred from the claim text.