H05K 2201/03
Conductive materials
H05K2201/03 (Conductive materials) appears on 8,281 US grants and 8,082 published applications in this corpus.
Search patents in H05K- Granted patents
- 8,281
- Published applications
- 8,082
- Assignees
- 2,341
- Inventors
- 15,766
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 34 | 0 |
| 1977 | 23 | 0 |
| 1978 | 23 | 0 |
| 1979 | 8 | 0 |
| 1980 | 26 | 0 |
| 1981 | 29 | 0 |
| 1982 | 35 | 0 |
| 1983 | 45 | 0 |
| 1984 | 48 | 0 |
| 1985 | 59 | 0 |
| 1986 | 61 | 0 |
| 1987 | 66 | 0 |
| 1988 | 66 | 0 |
| 1989 | 79 | 0 |
| 1990 | 97 | 0 |
| 1991 | 100 | 0 |
| 1992 | 128 | 0 |
| 1993 | 103 | 0 |
| 1994 | 120 | 0 |
| 1995 | 128 | 0 |
| 1996 | 108 | 0 |
| 1997 | 123 | 0 |
| 1998 | 168 | 0 |
| 1999 | 187 | 0 |
| 2000 | 182 | 0 |
| 2001 | 227 | 120 |
| 2002 | 271 | 317 |
| 2003 | 257 | 283 |
| 2004 | 259 | 374 |
| 2005 | 214 | 437 |
| 2006 | 249 | 429 |
| 2007 | 267 | 456 |
| 2008 | 239 | 449 |
| 2009 | 243 | 549 |
| 2010 | 287 | 415 |
| 2011 | 290 | 340 |
| 2012 | 353 | 280 |
| 2013 | 284 | 270 |
| 2014 | 239 | 307 |
| 2015 | 234 | 395 |
| 2016 | 255 | 306 |
| 2017 | 284 | 245 |
| 2018 | 244 | 245 |
| 2019 | 248 | 241 |
| 2020 | 213 | 265 |
| 2021 | 221 | 258 |
| 2022 | 206 | 257 |
| 2023 | 196 | 238 |
| 2024 | 189 | 221 |
| 2025 | 163 | 163 |
| 2026 | 103 | 222 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Low-profile fasteners with springs for heat transfer device loading6 Oct 2026US 12,757,316 B2Intel Corporation
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Electronic component and method of manufacturing the same29 Sep 2026US 12,750,954 B2Murata Manufacturing Co., Ltd.
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Electronic device and method of manufacturing the same24 Sep 2026US 2026/0292977 A1Advanced Semiconductor Engineering, Inc.
- Resin composition, prepreg, layered sheet, printed circuit board, and semiconductor package17 Sep 2026US 2026/0282221 A1Resonac Corporation
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002