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US 2026/0292977 A1Published application
Electronic device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsPo-Ming LEE, Erh-Ju LIN, Lu-Ming LAI
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Abstract
An electronic device and method of manufacturing the same are provided. The electronic device includes a carrier, a conductive layer over the carrier, and an optical component. The optical component includes an electrode bonded to the conductive layer. An average grain size of the electrode is greater than an average grain size of the conductive layer.
Claims20
An electronic device, comprising:
- a carrier;
- a conductive layer over the carrier;
- and
- an optical component comprising an electrode bonded to the conductive layer,
- wherein an average grain size of the electrode is greater than an average grain size of the conductive layer.
2 more elements
An electronic device, comprising:
- a first carrier;
- a conductive layer having a first surface roughness at a first surface of the conductive layer;
- a roughness smoothening layer over the first surface of the conductive layer and has a second surface, spaced apart from the first surface, with a second surface roughness less than the first surface roughness;
- a second carrier;
- and
- a bonding layer on the second carrier and bonded to the second surface of the roughness smoothening layer.
3 more elements
A method of manufacturing an electronic device, comprising:
- providing a carrier;
- forming a first ultra-fine grain copper (UFG-Cu) layer over the carrier;
- providing an electronic component comprising a first electrode;
- and
- bonding the first UFG-Cu layer to the first electrode,
- wherein an average grain size of the first UFG-Cu layer is equal to or less than about 150 nm.
3 more elements
Dependencies are inferred from the claim text.