Electronic component and method of manufacturing the same

An electronic component comprising:

• a substrate;
• a first electrode layer on the substrate and including conductive fillers and a binder;
• an insulation layer on the first electrode layer, the insulation layer having a via hole that penetrates the insulation layer in a lamination direction of the substrate, the first electrode layer, and the insulation layer;
• a second electrode layer on the insulation layer;
• and
• a via conductor in the via hole, the via conductor electrically coupling the first electrode layer and the second electrode layer,
• wherein a portion of the first electrode layer overlapping with the via hole in a top view includes a coupling layer coupled to the via conductor,
• wherein in the coupling layer the conductive fillers are bonded to each other and a part of the via conductor is present in a gap between the bonded conductive fillers,
• wherein the portion of the first electrode layer overlapping with the via hole in the top view further includes a base layer between the coupling layer and the substrate, and
• wherein a content rate of the binder in the base layer is larger than a content rate of the binder in the coupling layer.