Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorIn Gun KIM
Life of this patent
Estimating the term…
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorIn Gun KIM
Estimating the term…
A printed circuit board includes a glass layer having a first surface, and a second surface opposing the first surface, a through-via penetrating the glass layer, a first wiring layer disposed on and in contact with the first surface of the glass layer, a first insulating layer disposed on the first surface and covering the first wiring layer, a second insulating layer disposed on the second surface of the glass layer and covering a side surface of the glass layer connecting the first and second surfaces of the glass layer, a second wiring layer disposed on the second insulating layer, and a connection via penetrating the second insulating layer to connect the second wiring layer and the through-via to each other, the connection via being in contact with the through-via. The first insulating layer includes an insulating material different from an insulating material of the second insulating layer.
A printed circuit board comprising:
Dependencies are inferred from the claim text.