H05K 2201/0302
Properties and characteristics in general
H05K2201/0302 (Properties and characteristics in general) appears on 1,364 US grants and 1,198 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,364
- Published applications
- 1,198
- Assignees
- 682
- Inventors
- 3,146
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 6 | 0 |
| 1981 | 6 | 0 |
| 1982 | 7 | 0 |
| 1983 | 8 | 0 |
| 1984 | 13 | 0 |
| 1985 | 10 | 0 |
| 1986 | 6 | 0 |
| 1987 | 10 | 0 |
| 1988 | 13 | 0 |
| 1989 | 18 | 0 |
| 1990 | 15 | 0 |
| 1991 | 24 | 0 |
| 1992 | 32 | 0 |
| 1993 | 18 | 0 |
| 1994 | 23 | 0 |
| 1995 | 27 | 0 |
| 1996 | 16 | 0 |
| 1997 | 21 | 0 |
| 1998 | 24 | 0 |
| 1999 | 20 | 0 |
| 2000 | 26 | 0 |
| 2001 | 37 | 27 |
| 2002 | 55 | 52 |
| 2003 | 38 | 51 |
| 2004 | 48 | 58 |
| 2005 | 31 | 60 |
| 2006 | 33 | 60 |
| 2007 | 55 | 55 |
| 2008 | 33 | 46 |
| 2009 | 40 | 55 |
| 2010 | 34 | 51 |
| 2011 | 36 | 44 |
| 2012 | 45 | 33 |
| 2013 | 44 | 51 |
| 2014 | 23 | 50 |
| 2015 | 39 | 60 |
| 2016 | 48 | 46 |
| 2017 | 49 | 41 |
| 2018 | 38 | 51 |
| 2019 | 40 | 43 |
| 2020 | 39 | 53 |
| 2021 | 42 | 54 |
| 2022 | 45 | 41 |
| 2023 | 35 | 38 |
| 2024 | 26 | 34 |
| 2025 | 25 | 23 |
| 2026 | 24 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/0305Solder used for other purposes than connections between pcb or componentsIndexing code413
- H05K 2201/0317Thin film conductor layerIndexing code338
- H05K 2201/0311Metallic part with specific elastic propertiesIndexing code282
- H05K 2201/0314Elastomeric connector or conductorIndexing code264
- H05K 2201/0308Shape memory alloy [sma]Indexing code39
Recent patents
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Liquid metal circuits and methods of making the same18 Aug 2026US 12,713,523 B2Carnegie Mellon University
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Stackable memory module with double-sided compression contact pads11 Aug 2026US 12,707,566 B2Intel Corporation
- Substrate structure connected on basis of solder ball and elastic body7 Jul 2026US 12,677,371 B2Samsung Electronics Co., Ltd.
- Electronic device and method of manufacturing the same24 Sep 2026US 2026/0292977 A1Advanced Semiconductor Engineering, Inc.
- Component covers inhibiting dynamic component warping during reflow10 Sep 2026US 2026/0271194 A1International Business Machines Corporation
- Printed circuit board and manufacturing method thereof27 Aug 2026US 2026/0255479 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board and semiconductor package23 Jul 2026US 2026/0214798 A1LG Innotek Co., Ltd.
- Electronic device with electromagnetic shielding9 Jul 2026US 2026/0197933 A1Arcadyan Technology Corporation
Most cited
By later US patents
- High flux LED array297US 6,498,355 B1Lumileds Lighting U.S., LLC · 2002
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Pad array semiconductor device264US 5,592,025 AMotorola, Inc. · 1997
- Method of manufacturing a thin-film pattern on a substrate253US 5,259,926 AHitachi, Ltd. · 1993