H05K 2201/0317
Thin film conductor layer
Official title: Thin film conductor layer; Thin film passive component
H05K2201/0317 (Thin film conductor layer) appears on 338 US grants and 255 published applications in this corpus.
Search patents in H05K- Granted patents
- 338
- Published applications
- 255
- Assignees
- 199
- Inventors
- 898
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 9 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 3 | 0 |
| 1991 | 12 | 0 |
| 1992 | 12 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 13 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 17 | 8 |
| 2002 | 16 | 18 |
| 2003 | 10 | 18 |
| 2004 | 12 | 19 |
| 2005 | 8 | 17 |
| 2006 | 7 | 14 |
| 2007 | 17 | 13 |
| 2008 | 8 | 14 |
| 2009 | 8 | 11 |
| 2010 | 5 | 9 |
| 2011 | 5 | 4 |
| 2012 | 6 | 3 |
| 2013 | 8 | 10 |
| 2014 | 4 | 14 |
| 2015 | 9 | 14 |
| 2016 | 14 | 9 |
| 2017 | 7 | 8 |
| 2018 | 10 | 6 |
| 2019 | 9 | 7 |
| 2020 | 3 | 4 |
| 2021 | 4 | 8 |
| 2022 | 7 | 7 |
| 2023 | 5 | 7 |
| 2024 | 3 | 8 |
| 2025 | 4 | 2 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Inductor assembly and manufacturing method for inductor assembly3 Mar 2026US 12,568,586 B2Shennan Circuits Co., Ltd.
- Wiring substrate and method for manufacturing wiring substrate13 Jan 2026US 12,526,918 B2Niterra Co., Ltd.
- Substrates having adhesion promotor layers and related methods30 Dec 2025US 12,512,397 B2Intel Corporation
- Wiring substrate and method for manufacturing the same25 Nov 2025US 12,484,159 B2Ibiden Co., Ltd.
- Printed circuit board and manufacturing method thereof27 Aug 2026US 2026/0255479 A1Samsung Electro-Mechanics Co., Ltd.
- Apparatus for Treating a Surface of a Printed Circuit Board, Printed Circuit Board with Multi-Profiled Portion, and Method14 May 2026US 2026/0136469 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- High-Density Multi-Level Interconnects for Harsh Environments and Power Packaging and Method of Making The Same12 Feb 2026US 2026/0047003 A1
- Circuit board and method for manufacturing mounting board20 Feb 2025US 2025/0063665 A1TDK Corporation
- Method for manufacturing circuit board20 Feb 2025US 2025/0063671 A1Lx Semicon Co., Ltd.
Most cited
By later US patents
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Method of manufacturing a thin-film pattern on a substrate253US 5,259,926 AHitachi, Ltd. · 1993
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Interposer with embedded circuitry and method for using the same to package microelectronic units175US 5,973,391 ARead-Rite Corporation · 1999