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US 2025/0063671 A1Published application
Method for manufacturing circuit board
AssigneeLx Semicon Co., Ltd.
InventorsNam Tae CHO, Jun Ho LEE
Life of this patent
Estimating the term…
Abstract
Present embodiment relates to a method for manufacturing a circuit board, and more specifically, to a technique for solving problems that may arise due to etching by injecting epoxy or silicon or inserting a metal block into a gap formed between two or more ceramic substrates.
Claims15
A method for manufacturing a circuit board comprising:
- a step of placing two or more ceramic substrates side by side in a plane;
- a step of arranging the two or more ceramic substrates within surfaces where an upper meal sheet and a lower metal sheet face each other;
- a step of injecting epoxy or silicone into a gap between the two or more ceramic substrates;
- a step of bonding the upper metal sheet and the two or more ceramic substrates, and the lower metal sheet and the two or more ceramic substrates;
- and
- a step of etching the upper metal sheet and the lower metal sheet.
3 more elements
A method for manufacturing a circuit board, comprising:
- a step of placing two or more ceramic substrates side by side in a plane;
- a step of arranging the two or more ceramic substrates within surfaces where the upper metal sheet and the lower metal sheet face each other;
- a step of inserting a metal block into a gap between the two or more ceramic substrates;
- a step of bonding the upper metal sheet and the two or more ceramic substrates, and the lower metal sheet and the two or more ceramic substrates;
- and
- a step of etching the upper metal sheet and the lower metal sheet.
3 more elements
Dependencies are inferred from the claim text.