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US 2025/0063665 A1Published application
Circuit board and method for manufacturing mounting board
AssigneeTDK Corporation
InventorsYukari WADA, Akiko SEKI, Yuhei HOTTA, Atsushi SATO
Life of this patent
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Abstract
A circuit board includes: a substrate; at least a pair of terminals provided on the substrate; a bonding material disposed on the terminals and containing a metal element; and a wall of an insulating material disposed on the substrate, in which the pair of terminals and the bonding material are disposed inside the wall, and at least one wall-frame portion of the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface.
Claims9
A circuit board comprising:
- a substrate;
- at least a pair of terminals provided on the substrate;
- a bonding material disposed on the terminals and containing a metal element;
- and
- a wall of an insulating material disposed on the substrate, wherein
- the pair of terminals and the bonding material are disposed inside the wall, and
- at least one wall-frame portion of the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface.
4 more elements
Dependencies are inferred from the claim text.