Apparatus for Treating a Surface of a Printed Circuit Board, Printed Circuit Board with Multi-Profiled Portion, and Method
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorChristoph WAGNER
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Abstract
An apparatus for treating a portion of a surface of at least one electrically conductive layer structure of a layer stack of a printed circuit board or the like comprises a surface treatment unit configured to alter along a predefined multi-profiled shape a portion of the exposed surface of the at least one electrically conductive layer structure. Further, there is described a PCB or the like and a method for treating a surface.
Claims20
An apparatus for treating a portion of a surface of at least one electrically conductive layer structure of a layer stack of a printed circuit board or the like, comprising:
- a surface treatment unit, configured to alter along a predefined multi-profiled shape a portion of the exposed surface of the at least one electrically conductive layer structure.
A PCB or the like, having a layer stack, comprising:
- at least one electrically conductive layer structure;
- wherein a main surface of the at least one electrically conductive layer structure comprises an altered portion having a predefined multi-profiled shaped portion, defining an identification mark and/or a legend print.
A method of treating a portion of a surface of at least one electrically conductive layer structure of a layer stack of a PCB or the like, the method comprising:
- providing a PCB or the like;
- treating the PCB or the like by altering along a predefined multi-profiled shape a portion of the exposed surface of the at least one electrically conductive layer structure.
Dependencies are inferred from the claim text.