Substrates having adhesion promotor layers and related methods

A method for manufacturing a package assembly, the method comprising:

• providing a conductive layer on a substrate;
• depositing, via physical vapor deposition, an adhesion promotor layer to the conductive layer and exposed surfaces of the substrate;
• applying a dielectric layer on the adhesion promotor layer;
• providing a via between a first side of the dielectric layer and a second side of the dielectric layer opposite the first side to expose a portion of the adhesion promotor layer in the via;
• removing, using dry desmear, the exposed portion of the adhesion promotor layer from the via;
• rinsing the via with a liquid to remove fluorine (F) residue from the via;
• and
• applying a reduction conditioner treatment to remove precipitates from the substrate after the rinsing of the via with the liquid.

A method for manufacturing a package substrate, the method comprising:

• depositing a conductive layer on a first side of a substrate, the conductive layer having a smooth, non-roughened surface finish;
• depositing a non-roughening adhesion promotor layer on the substrate and the conductive layer;
• laminating a dielectric material to the non-roughening adhesion promotor layer;
• drilling a via in the dielectric material to expose a portion of the non-roughening adhesion promotor layer;
• removing, via dry desmear, the exposed portion of the non-roughening adhesion promotor layer to uncover a portion of the conductive layer in the via;
• rinsing the uncovered portion of the conductive layer in the via with a liquid;
• and
• applying a seed layer to the uncovered portion of the conductive layer and a wall of the via.