Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJong Tae Park
Life of this patent
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Abstract
A printed circuit board according to an embodiment may include an insulating layer, a first circuit pattern buried in the insulating layer such that one surface thereof is exposed on one surface of the insulating layer, a second circuit pattern disposed on the other surface, which is opposite to the one surface of the insulating layer, the second circuit pattern protruding from the other surface, a surface conductive layer disposed on at least a portion of the first circuit pattern, the surface conductive layer being made of a material different from that of the first circuit pattern, a surface treatment layer on the surface conductive layer, and a solder resist layer disposed on the one surface to expose the surface treatment layer.
Claims17
A printed circuit board comprising:
- an insulating layer;
- a first circuit pattern buried in the insulating layer such that a first surface of the insulating layer does not cover a first surface of the first circuit pattern;
- a second circuit pattern disposed on a second surface of the insulating layer, the second surface being opposite to the first surface of the insulating layer, and the second circuit pattern protruding from the second surface;
- a surface conductive layer disposed on at least a portion of the first circuit pattern, the surface conductive layer including a first material different from a second material included in the first circuit pattern;
- a surface treatment layer on the surface conductive layer;
- and
- a solder resist layer disposed on the first surface of the insulating layer to expose the surface treatment layer.
A manufacturing method of a printed circuit board comprising:
- forming a surface seed layer on a carrier,
- forming a first circuit pattern on the surface seed layer,
- forming an insulating layer on the surface seed layer to cover the first circuit pattern,
- forming a second circuit pattern on the insulating layer,
- removing the carrier,
- forming a surface treatment layer on the surface seed layer, the surface treatment layer overlapping at least a portion of the first circuit pattern,
- forming a surface conductive layer interposing the first circuit pattern and the surface treatment layer by removing a portion of the surface seed layer exposed by the surface treatment layer, and
- forming a solder resist layer exposing the surface treatment layer on the insulating layer.
Dependencies are inferred from the claim text.