Substrate structure connected on basis of solder ball and elastic body
AssigneeSamsung Electronics Co., Ltd.
InventorsJongwan Shim, Bumhee Bae, Younho Kim, Jeongnam Cheon
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AssigneeSamsung Electronics Co., Ltd.
InventorsJongwan Shim, Bumhee Bae, Younho Kim, Jeongnam Cheon
Estimating the term…
A substrate structure is provided. The substrate structure includes a first substrate, a plurality of first elastomer pins arranged on the first substrate, an elastic body disposed on the first substrate to surround the plurality of first elastomer pins, the elastic body including a plurality of spaces for receiving a plurality of solder balls on a second substrate connected to the first substrate, and a plurality of solder ball holders arranged on a boundary area of an opening of each of the plurality of spaces, wherein each of the plurality of solder ball holders has strength higher than that of the elastic body, and wherein each of the plurality of solder ball holders includes a plurality of pieces.
A substrate structure, comprising:
Dependencies are inferred from the claim text.