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US 12,707,566 B2Granted
Stackable memory module with double-sided compression contact pads
AssigneeIntel Corporation
InventorsXiang Li, Konika Ganguly, George Vergis, Stephen Christianson, Xiaopeng Dong
Life of this patent
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Abstract
An example of an apparatus may comprise a first set of compression contact pads formed on a first side of a circuit board, a second set of compression contact pads formed on a second side of the circuit board opposite to the first side of the circuit board, where the first set of compression contact pads are respectively electrically connected to the second set of compression pads. An example of the circuit board may include a memory board. An example stackable memory module may include memory devices mounted to both sides of the memory board. Other examples are disclosed and claimed.
Claims17
An apparatus, comprising:
- a memory board comprising:
- a first plurality of compression contact pads at a first side of the memory board;
- and
- a second plurality of compression contact pads at a second side of the memory board, the second side opposite to the first side, wherein the first plurality of compression contact pads are each electrically coupled, through the memory board, to a different respective compression contact pad of the second plurality of compression contact pads, wherein multiple microvias of the memory board are electrically coupled to each other in a stacked arrangement between one of the first plurality of compression contact pads and one of the second plurality of compression contact pads;
- and
- two or more memory devices each coupled to the memory board independent of both the first plurality of compression contact pads and the second plurality of compression contact pads, wherein the two or more memory devices each adjoin a respective one of the first side or the second side, and wherein the two or more memory devices are further electrically coupled to the first plurality of compression contact pads.
3 more elements
A method, comprising:
- forming a first plurality of compression contact pads on a first side of a memory board;
- forming a second plurality of compression contact pads on a second side of the memory board, wherein the second side is opposite to the first side;
- and
- electrically coupling the first plurality of compression contact pads, through the memory board, each to a different respective compression contact pad of the second plurality of compression contact pads, the electrically coupling comprising:
- forming multiple microvias which are electrically coupled to each other in a stacked arrangement between one of the first plurality of compression contact pads and one of the second plurality of compression contact pads;
- and
- coupling two or more memory devices each to the memory board independent of both the first plurality of compression contact pads and the second plurality of compression contact pads, wherein the two or more memory devices each adjoin a respective one of the first side or the second side.
4 more elements
A system, comprising:
- a main board comprising a first plurality of compression contact pads at a first side of the main board;
- a first memory module comprising:
- a memory board comprising:
- a second plurality of compression contact pads at a second side of the memory board;
- and
- a third plurality of compression contact pads at a third side of the memory board, the third side opposite to the second side, wherein the second plurality of compression contact pads are each electrically coupled, through the memory board, to a different respective compression contact pad of the third plurality of compression contact pads, and wherein multiple microvias of the memory board are electrically coupled to each other in a stacked arrangement between one of the second plurality of compression contact pads and one of the third plurality of compression contact pads;
- and
- two or more memory devices each coupled to the memory board independent of both the second plurality of compression contact pads and the third plurality of compression contact pads, wherein the two or more memory devices each adjoin a respective one of the second side or the third side, and wherein the two or more memory devices are further electrically coupled to the first plurality of compression contact pads;
- and
- a first compression mount connector compressed between the main board and the first memory module to communicatively couple the first plurality of compression contact pads to the second plurality of compression contact pads.
7 more elements
Dependencies are inferred from the claim text.