Component covers inhibiting dynamic component warping during reflow

Abstract

A method is provided for inhibiting dynamic component warping during a circuit board reflow process. The method includes obtaining a cover for a component of a circuit board, where the cover includes a shape memory alloy structure configured to inhibit warping of the component during the reflow process. Further, the method includes coupling the cover to the component of the circuit board to form a covered component. The coupling ensures that, with reaching of a transition energy threshold during the reflow process, the shape memory alloy structure of the cover generates, based on a shape memory alloy transition, a force in a direction to inhibit the warping of the component during the reflow process.

Dependencies are inferred from the claim text.