H05K 2201/0311
Metallic part with specific elastic properties
Official title: Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
H05K2201/0311 (Metallic part with specific elastic properties) appears on 282 US grants and 316 published applications in this corpus.
Search patents in H05K- Granted patents
- 282
- Published applications
- 316
- Assignees
- 203
- Inventors
- 644
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 2 |
| 2002 | 3 | 1 |
| 2003 | 5 | 3 |
| 2004 | 1 | 4 |
| 2005 | 3 | 10 |
| 2006 | 7 | 18 |
| 2007 | 10 | 12 |
| 2008 | 5 | 8 |
| 2009 | 11 | 17 |
| 2010 | 11 | 18 |
| 2011 | 10 | 19 |
| 2012 | 17 | 18 |
| 2013 | 14 | 21 |
| 2014 | 11 | 12 |
| 2015 | 15 | 16 |
| 2016 | 14 | 9 |
| 2017 | 15 | 13 |
| 2018 | 6 | 11 |
| 2019 | 8 | 12 |
| 2020 | 13 | 16 |
| 2021 | 14 | 19 |
| 2022 | 16 | 22 |
| 2023 | 13 | 13 |
| 2024 | 13 | 7 |
| 2025 | 13 | 7 |
| 2026 | 8 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Stackable memory module with double-sided compression contact pads11 Aug 2026US 12,707,566 B2Intel Corporation
- Differential transmission board set and assembly9 Jun 2026US 12,652,773 B2Japan Aviation Electronics Industry, Limited
- Connector-less M.2 module19 May 2026US 12,633,688 B2Intel Corporation
- Differential transmission board set and assembly19 May 2026US 12,635,099 B2Japan Aviation Electronics Industry, Limited
- Differential transmission board set and assembly12 May 2026US 12,628,300 B2Japan Aviation Electronics Industry, Limited
- Circuit board, an image sensor module, a lens driving device, and a camera module including the same21 May 2026US 2026/0143217 A1LG Innotek Co., Ltd.
- Circuit board coupling structure21 May 2026US 2026/0143612 A1LG Energy Solution, Ltd.
- Flexible mounting structures for surface mount components2 Apr 2026US 2026/0096027 A1Intel Corporation
- Surgical instrument and assembling method therefor12 Mar 2026US 2026/0074542 A1Ezisurg Medical Co., Ltd.
- Implantable electronic devices26 Feb 2026US 2026/0054076 A1Curonix LLC
Most cited
By later US patents
- Method of making microelectronic spring contact elements226US 6,184,053 B2FormFactor, Inc. · 2001
- Sockets for "springed" semiconductor devices115US 6,033,935 AFormFactor, Inc. · 2000
- Interconnect for microelectronic structures with enhanced spring characteristics100US 6,827,584 B2FormFactor, Inc. · 2004
- Sockets for “springed” semiconductor devices91US 6,534,856 B1FormFactor, Inc. · 2003
- Integrated gimbal suspension assembly90US 5,598,307 AHutchinson Technology Incorporated · 1997