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US 2026/0096027 A1Published application
Flexible mounting structures for surface mount components
AssigneeIntel Corporation
InventorsMin Suet Lim, Seok Ling Lim, Eng Huat Goh, Jeff Ku, Kavitha Nagarajan, Jackson C.P. Kong
Life of this patent
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Abstract
In one embodiment, an apparatus includes a circuit board (e.g., a motherboard) having conductive contacts that are integral with and extend away from a first metal layer of the circuit board. The contacts may extend away from the circuit board at an angle less than 90 degrees (e.g., less than 45 degrees in some embodiments). The contacts may include flat surfaces that are elevated away from and generally parallel with the upper surface of the circuit board.
Claims20
An apparatus comprising:
- a circuit board comprising:
- a first metal layer adjacent an upper surface of the circuit board;
- and
- conductive contacts integral with and extending away from the first metal layer.
1 more element
An apparatus comprising:
- a circuit board comprising conductive contacts integral with and extending away from an upper metal layer of the circuit board, the conductive contacts comprising a flat surface that is elevated vertically from the upper surface of the circuit board;
- and
- one or more circuit components coupled to the conductive contacts.
A computing device comprising:
- a motherboard;
- a processor coupled to the motherboard;
- memory coupled to the motherboard;
- and
- circuit components coupled to the motherboard, wherein at least one circuit component is coupled to the motherboard via conductive contacts that are integral with and extend upward from a first metal layer of the motherboard.
2 more elements
Dependencies are inferred from the claim text.