H05K 2201/0305
Solder used for other purposes than connections between pcb or components
Official title: Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
H05K2201/0305 (Solder used for other purposes than connections between pcb or components) appears on 413 US grants and 291 published applications in this corpus.
Search patents in H05K- Granted patents
- 413
- Published applications
- 291
- Assignees
- 217
- Inventors
- 859
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 7 | 0 |
| 1991 | 6 | 0 |
| 1992 | 11 | 0 |
| 1993 | 7 | 0 |
| 1994 | 12 | 0 |
| 1995 | 14 | 0 |
| 1996 | 9 | 0 |
| 1997 | 12 | 0 |
| 1998 | 10 | 0 |
| 1999 | 9 | 0 |
| 2000 | 11 | 0 |
| 2001 | 15 | 15 |
| 2002 | 29 | 28 |
| 2003 | 19 | 22 |
| 2004 | 29 | 28 |
| 2005 | 14 | 11 |
| 2006 | 12 | 10 |
| 2007 | 14 | 15 |
| 2008 | 12 | 15 |
| 2009 | 10 | 14 |
| 2010 | 7 | 9 |
| 2011 | 10 | 11 |
| 2012 | 8 | 6 |
| 2013 | 10 | 14 |
| 2014 | 3 | 15 |
| 2015 | 6 | 9 |
| 2016 | 9 | 10 |
| 2017 | 9 | 3 |
| 2018 | 7 | 9 |
| 2019 | 8 | 7 |
| 2020 | 5 | 10 |
| 2021 | 7 | 11 |
| 2022 | 9 | 2 |
| 2023 | 4 | 5 |
| 2024 | 3 | 6 |
| 2025 | 1 | 3 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Electronic device comprising solder wall6 Jan 2026US 12,520,431 B2Samsung Electronics Co., Ltd.
- Flexible LED strip21 Jan 2025US 12,203,613 B1
- Electronic device3 Sep 2024US 12,080,836 B2Panelsemi Corporation
- Printed circuit board for galvanic effect reduction5 Mar 2024US 11,924,964 B2Western Digital Technologies, Inc.
- Electronic device with electromagnetic shielding9 Jul 2026US 2026/0197933 A1Arcadyan Technology Corporation
- Component carrier and method for manufacturing a component carrier5 Mar 2026US 2026/0068043 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component carrier, method for manufacturing a component carrier and component carrier assembly5 Mar 2026US 2026/0068724 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for manufacturing conductive via-containing substrate, conductive via-containing substrate, and metal paste25 Dec 2025US 2025/0387833 A1
- Electronic device comprising solder wall10 Jul 2025US 2025/0227852 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- High flux LED array297US 6,498,355 B1Lumileds Lighting U.S., LLC · 2002
- Pad array semiconductor device264US 5,592,025 AMotorola, Inc. · 1997
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993
- BGA package using PCB and tape in a die-up configuration171US 6,069,407 AVLSI Technology, Inc. · 2000