Back to results
US 5,435,057 AGranted
Interconnection method and structure for organic circuit boards
AssigneeInternational Business Machines Corporation
InventorsPerminder S. Bindra, Ross D. Havens, Voya R. Markovich, Jaynal A. Molla
Life of this patent
Estimating the term…
Abstract
Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.
Claims9
A method for connecting at least two organic polymeric subcomposites of a circuit board which comprises:
- (a) providing metallic dendrites on electrical contact pads of said two organic polymeric subcomposites wherein electrical contact pads of one of said organic polymeric subcomposites face electrical contact pads of the other of said organic subcomposites;
- and wherein an electrical contact pad on one of the subcomposites is larger than the electrical contact pad it faces on the other subcomposite;
- (b) contacting the electrical contact pads that face each other;
- (c) heating said subcomposites while the said electrical contact pads that face each other are in contact with each other to form a bonded composite;
- (d) and then permitting said bonded composite to cool.
2 more elements
Dependencies are inferred from the claim text.