Electronic device

An electronic device, comprising:

• a plurality of surface mount structures, wherein each of the surface mount structures comprises:
• a substrate defined with a first surface and a second surface opposite to each other,
• a pattern circuit disposed on the first surface of the substrate, wherein the pattern circuit comprises at least two signal lines,
• at least two through holes communicating the first surface and the second surface of the substrate, wherein the at least two through holes are disposed corresponding to the at least two signal lines, respectively, and
• at least one optoelectronic element disposed on the first surface of the substrate, wherein two ends of the at least one optoelectronic element are respectively electrically connected to the at least two signal lines of the pattern circuit;
• a driving circuit board comprising a plurality of connection pad groups, wherein the plurality of connection pad groups are disposed corresponding to the plurality of surface mount structures, respectively, the second surfaces of the substrates of the plurality of surface mount structures are disposed on a surface of the driving circuit board configured with the plurality of connection pad groups, each of the plurality of connection pad groups comprises at least two connection pads respectively corresponding to the at least two through holes of one of the plurality of surface mount structures;
• and
• a plurality of conductive member units corresponding to the plurality of surface mount structures, wherein each of the plurality of conductive member units comprises at least two conductive members, the at least two conductive members of one of the plurality of conductive member units are disposed in the at least two through holes of one of the plurality of surface mount structures, respectively, extend to the first surface and the second surface of the substrate of the one of the plurality of surface mount structures, and electrically connect the at least two signal lines of one of the plurality of surface mounting structures to the at least two connection pads of one of the plurality of connection pad groups of the driving circuit board.