Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module

Abstract

A circuit board for a power semiconductor module, having at least one top side and one bottom side, wherein at least one mounting area for a power semiconductor component is provided on the top side, wherein on the mounting area, at least one solder layer is provided for connecting at least one power semiconductor component to the mounting area, which layer is divided into regions that are separated from one another by intermediate spaces, and wherein multiple thermal vias are provided in the circuit board and extend from the top side to the bottom side of the circuit board in the region of or near the mounting area, wherein each upper opening of the thermal vias is directly surrounded by a respective region of the solder layer and each lower opening of the vias is covered by a layer of electrically insulating material.

Dependencies are inferred from the claim text.