Printed circuit board for galvanic effect reduction

A method for reducing etching due to galvanic effect in a printed circuit board in an electronic device, the method comprising:

• determining a ratio of a surface area of a contact finger to a surface area of an exposed portion of a contact trace electrically connected to the contact finger, wherein the contact finger is configured to provide an electrical connection to an external electronic device;
• determining whether the ratio exceeds a predetermined threshold;
• responsive to determining that the ratio exceeds the predetermined threshold, separating the exposed portion of the contact trace into a via connection pad and an outer connection pad configured to be coupled to an impedance trace, wherein the via connection pad and outer connection pad are physically separated by a separation distance;
• plating the contact finger and the via connection pad with a common material;
• and
• electrically connecting the via connection pad and the outer connection pad using a solder joint.

A card-type data storage device, comprising:

• a substrate having a first side and a second side opposite to the first side;
• a contact finger disposed on the first side of the substrate configured to interface with a host device and plated with a plating material;
• a first trace coupled to the first contact finger and extending from the first side of the substrate to the second side of the substrate, wherein the first trace has an exposed portion disposed on the second side of the substrate in the form of a via connection pad, the via connection pad being plated with the plating material;
• and
• a second trace disposed on the second side of the substrate and coupled to an outer pad, wherein the outer pad surrounds the via connection pad and is electrically separated from the via connection pad by a separation distance;
• and
• wherein the via connection pad is electrically connected to the outer pad through a solder joint.