US 12,520,431 B2 · Electronic device comprising solder wall

Abstract

An electronic device may include: a flexible printed circuit board having a flexible region and a support region and configured to be deformable in the flexible region; an antenna module facing the support region of the flexible printed circuit board; a solder ball for connecting the antenna module to the flexible printed circuit board; an underfill resin filled between the flexible printed circuit board and the antenna module in a liquid state and then solidified; and a solder wall for connecting the antenna module to the flexible printed circuit board and placed between the solder ball and the flexible region to block the flow of the underfill from the support region toward the flexible region before the underfill resin is solidified, and the solder wall has a width equal to or greater than the width of the flexible region. Various other embodiments are possible.

Claims18

Dependent claims

An electronic device, comprising:

a flexible printed circuit board (FPCB) comprising a flexible area and a support area, where the FPCB is configured to be deformable in the flexible area;
an antenna module, comprising an antenna, facing the support area of the FPCB;
a solder ball for connecting the FPCB and the antenna module;
an underfill resin filled between at least the FPCB and the antenna module in a liquid state and then solidified;
and
a solder wall for connecting the FPCB and the antenna module and positioned between at least the solder ball and the flexible area to block a flow of the underfill resin from the support area toward the flexible area before the underfill resin is solidified, the solder wall comprising a width at least as great as a width of the flexible area.

3 more elements

Dependencies are inferred from the claim text.

Electronic device comprising solder wall

Life of this patent

Electronic device comprising solder wall

Life of this patent

Abstract

Claims18