Circuit board and semiconductor package
AssigneeLG Innotek Co., Ltd.
InventorTae Gyu KANG
Life of this patent
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Abstract
This embodiment relates to a circuit board and a semiconductor package. The circuit board according to one aspect comprises: an insulating layer; and a via electrode penetrating at least a portion of the insulating layer, wherein the via electrode includes a first layer, a second layer disposed on the first layer, and a third layer disposed between the first layer and the second layer and having a thickness thinner than the thickness of the first layer and the second layer, and wherein the grain size of the third layer is smaller than the grain size of the second layer.
Claims21
1-15. (canceled)
A circuit board comprising:
- an insulating layer;
- and
- a via electrode penetrating at least a portion of the insulating layer,
- wherein the via electrode includes a first layer, a second layer disposed on the first layer, and a third layer disposed between the first layer and the second layer and having a thickness thinner than thicknesses of the first layer and the second layer, and
- wherein a grain size of the third layer is smaller than a grain size of the second layer.
A semiconductor package comprising:
- an insulating layer;
- a semiconductor chip disposed on said insulating layer;
- and
- a via electrode penetrating at least a portion of said insulating layer,
- wherein the via electrode includes a first layer, a second layer disposed on said first layer, and a third layer disposed between the first layer and the second layer and having a thicknesses thinner than a thickness of both the first layer and the second layer, and
- wherein a grain size of the third layer is smaller than a grain size of the second layer.
Dependencies are inferred from the claim text.