H05K 2201/0332
Structure of the conductor
H05K2201/0332 (Structure of the conductor) appears on 6,309 US grants and 6,010 published applications in this corpus.
Search patents in H05K- Granted patents
- 6,309
- Published applications
- 6,010
- Assignees
- 1,717
- Inventors
- 11,486
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 29 | 0 |
| 1977 | 21 | 0 |
| 1978 | 22 | 0 |
| 1979 | 5 | 0 |
| 1980 | 20 | 0 |
| 1981 | 20 | 0 |
| 1982 | 29 | 0 |
| 1983 | 36 | 0 |
| 1984 | 37 | 0 |
| 1985 | 47 | 0 |
| 1986 | 43 | 0 |
| 1987 | 51 | 0 |
| 1988 | 49 | 0 |
| 1989 | 57 | 0 |
| 1990 | 75 | 0 |
| 1991 | 75 | 0 |
| 1992 | 92 | 0 |
| 1993 | 82 | 0 |
| 1994 | 96 | 0 |
| 1995 | 97 | 0 |
| 1996 | 85 | 0 |
| 1997 | 95 | 0 |
| 1998 | 146 | 0 |
| 1999 | 152 | 0 |
| 2000 | 156 | 0 |
| 2001 | 193 | 105 |
| 2002 | 231 | 268 |
| 2003 | 220 | 232 |
| 2004 | 216 | 312 |
| 2005 | 183 | 355 |
| 2006 | 213 | 343 |
| 2007 | 206 | 382 |
| 2008 | 188 | 364 |
| 2009 | 193 | 431 |
| 2010 | 238 | 328 |
| 2011 | 237 | 263 |
| 2012 | 275 | 205 |
| 2013 | 227 | 178 |
| 2014 | 188 | 216 |
| 2015 | 165 | 237 |
| 2016 | 161 | 196 |
| 2017 | 175 | 146 |
| 2018 | 148 | 145 |
| 2019 | 147 | 141 |
| 2020 | 137 | 172 |
| 2021 | 148 | 173 |
| 2022 | 140 | 195 |
| 2023 | 134 | 177 |
| 2024 | 147 | 154 |
| 2025 | 114 | 109 |
| 2026 | 68 | 183 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Low-profile fasteners with springs for heat transfer device loading6 Oct 2026US 12,757,316 B2Intel Corporation
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Resin composition, prepreg, layered sheet, printed circuit board, and semiconductor package17 Sep 2026US 2026/0282221 A1Resonac Corporation
- Component carrier with stacked electrically conductive layers, embedded and on the surface17 Sep 2026US 2026/0282223 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002