H05K 2201/0364
Conductor shape
H05K2201/0364 (Conductor shape) appears on 2,196 US grants and 2,050 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,196
- Published applications
- 2,050
- Assignees
- 774
- Inventors
- 4,251
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 7 | 0 |
| 1978 | 9 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 12 | 0 |
| 1986 | 10 | 0 |
| 1987 | 14 | 0 |
| 1988 | 10 | 0 |
| 1989 | 18 | 0 |
| 1990 | 20 | 0 |
| 1991 | 25 | 0 |
| 1992 | 23 | 0 |
| 1993 | 31 | 0 |
| 1994 | 31 | 0 |
| 1995 | 27 | 0 |
| 1996 | 34 | 0 |
| 1997 | 41 | 0 |
| 1998 | 54 | 0 |
| 1999 | 61 | 0 |
| 2000 | 57 | 0 |
| 2001 | 72 | 38 |
| 2002 | 71 | 87 |
| 2003 | 72 | 69 |
| 2004 | 65 | 99 |
| 2005 | 61 | 107 |
| 2006 | 65 | 103 |
| 2007 | 76 | 157 |
| 2008 | 79 | 160 |
| 2009 | 82 | 150 |
| 2010 | 96 | 122 |
| 2011 | 96 | 88 |
| 2012 | 114 | 67 |
| 2013 | 72 | 60 |
| 2014 | 61 | 95 |
| 2015 | 67 | 91 |
| 2016 | 70 | 78 |
| 2017 | 64 | 50 |
| 2018 | 60 | 55 |
| 2019 | 52 | 43 |
| 2020 | 47 | 60 |
| 2021 | 51 | 52 |
| 2022 | 42 | 61 |
| 2023 | 42 | 52 |
| 2024 | 44 | 43 |
| 2025 | 37 | 27 |
| 2026 | 20 | 36 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/0367Metallic bump or raised conductor not used as solder bumpIndexing code1,102
- H05K 2201/0376Flush conductors, i.e. flush with the surface of the printed circuitIndexing code370
- H05K 2201/0373Conductors having a fine structureIndexing code314
- H05K 2201/0382Continuously deformed conductorsIndexing code249
- H05K 2201/0379Stacked conductorsIndexing code225
- H05K 2201/037Hollow conductors, i.e. conductors partially or completely surrounding a voidIndexing code63
- H05K 2201/0385Displaced conductorsIndexing code7
Recent patents
- Low-profile fasteners with springs for heat transfer device loading6 Oct 2026US 12,757,316 B2Intel Corporation
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Circuit board having concave ribbon bonds7 Jul 2026US 12,674,554 B1Ford Global Technologies, LLC
- Modular routable circuit board conductor blocks16 Jun 2026US 12,660,095 B2Microsoft Technology Licensing, LLC
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Component Carrier With Vertically Connected Cavity Sub-Portions30 Jul 2026US 2026/0223704 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Integrated circuit23 Jul 2026US 2026/0215317 A1Pragmatic Semiconductor Limited
- Component Carrier with Different Line Spacing in Metal Traces, and Manufacture Method9 Jul 2026US 2026/0197938 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989