H05K 2201/0382
Continuously deformed conductors
H05K2201/0382 (Continuously deformed conductors) appears on 249 US grants and 173 published applications in this corpus.
Search patents in H05K- Granted patents
- 249
- Published applications
- 173
- Assignees
- 156
- Inventors
- 553
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 8 | 0 |
| 1998 | 8 | 0 |
| 1999 | 6 | 0 |
| 2000 | 8 | 0 |
| 2001 | 14 | 7 |
| 2002 | 10 | 13 |
| 2003 | 10 | 11 |
| 2004 | 11 | 11 |
| 2005 | 6 | 8 |
| 2006 | 12 | 9 |
| 2007 | 3 | 15 |
| 2008 | 5 | 14 |
| 2009 | 7 | 12 |
| 2010 | 11 | 8 |
| 2011 | 8 | 6 |
| 2012 | 8 | 2 |
| 2013 | 5 | 2 |
| 2014 | 4 | 6 |
| 2015 | 6 | 10 |
| 2016 | 4 | 6 |
| 2017 | 5 | 4 |
| 2018 | 7 | 3 |
| 2019 | 4 | 4 |
| 2020 | 3 | 6 |
| 2021 | 5 | 3 |
| 2022 | 4 | 3 |
| 2023 | 1 | 1 |
| 2024 | 2 | 4 |
| 2025 | 2 | 1 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Circuit board having concave ribbon bonds7 Jul 2026US 12,674,554 B1Ford Global Technologies, LLC
- Sidewall plating of circuit boards for layer transition connections5 Aug 2025US 12,382,581 B2International Business Machines Corporation
- Interconnect structure for insertion loss reduction in signal transmission and method thereof22 Apr 2025US 12,283,488 B2Yuan Ze University
- Circuit board, method for producing circuit board, and imaging apparatus12 Mar 2024US 11,929,569 B2Ricoh Company, Ltd.
- Printed circuit board28 May 2026US 2026/0150189 A1Samsung Electro-Mechanics Co., Ltd.
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Flexible mounting structures for surface mount components2 Apr 2026US 2026/0096027 A1Intel Corporation
- Devices, systems, and methods for creating and managing health records using data generated by flexible circuits1 Jan 2026US 2026/0003429 A1Liquid Wire Inc.
- Rechargeable battery module23 Jan 2025US 2025/0030129 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Soldering with resilient contacts217US 5,980,270 ATessera, Inc. · 1999
- Soldering with resilient contacts176US 5,615,824 ATessera, Inc. · 1997
- Microelectronic contacts with asperities and methods of making same175US 5,632,631 ATessera, Inc. · 1997
- Microelectronic connector for engaging bump leads154US 5,812,378 ATessera, Inc. · 1998