US 5,812,378 A · Microelectronic connector for engaging bump leads

Abstract

A connector for microelectronic includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Claims60

Dependent claims

A connector for mounting a microelectronic element to a substrate comprising:

(a) a sheetlike body having first and second major surfaces and having a plurality of holes open to said first major surface, said holes being disposed in an array corresponding to an array of bump leads on the microelectronic device to be mounted;
(b) an array of resilient, generally laminar contacts secured to said first major surface of said body in registration with said holes, each said contact including a ring of a sheetlike metallic contact material overlying the first surface of the body and encircling the opening of the associated hole, each said contact further including at least one projection formed integrally with the ring and extending inwardly over one said hole from said first major surface, each said contact being adapted to resiliently engage a bump lead inserted into the associated hole and to make electrical connection with the bump lead as a result of the resilient engagement, said contact material including a bonding surface layer selected from the group consisting of heat-activatable bonding materials;
and
(c) an array of terminals electrically connected to said contacts, whereby a microelectronic component can be connected to a substrate by bonding said terminals to said substrate and superposing said microelectronic element on said body so that bump leads on the component protrude into said holes and are engaged by said resilient contacts and thereby electrically connected to them.

1 more element

A connector for mounting a microelectronic element to a substrate comprising:

(a) a sheet-like body having first and second major surfaces and having a plurality of holes extending through said body from said first major surface to said second major surface so that each said hole has first-surface and second-surface ends, said holes being disposed in an array corresponding to an array of bump leads on the microelectronic device to be mounted, said holes further being disposed in a regular, grid-like pattern at intervals of less than about 2.5 mm;
(b) an array of resilient, generally laminar contacts secured to said first major surface of said body in registration with said holes so that each said contact extends inwardly over one said hole from said first major surface, each said contact being adapted to resiliently engage a bump lead inserted into the associated hole;
(c) an array of terminals electrically connected to said contacts, each said terminal being disposed on said second major surface adjacent the second-surface end of one said hole;
and
(d) through conductors extending within said hole, the contact and terminal associated with each said hole being connected to one another by the through conductor extending within such hole;
(e) whereby a microelectronic component can be connected to a substrate by bonding said terminals to said substrate and superposing said microelectronic element on said body so that bump leads on the component protrude into said holes and are engaged by said resilient contacts.

3 more elements

A connector for mounting a microelectronic element to a substrate comprising:

(a) a sheet-like body having first and second major surfaces and having a plurality of holes open to said first major surface, said holes being disposed in an array corresponding to an array of bump leads on the microelectronic device to be mounted;
(b) an array of resilient, generally laminar contacts secured to said first major surface of said body in registration with said holes, each said contact including a ring of sheet-like metallic contact material overlying the first surface of the body and encircling the opening of the associated hole, wherein each said contact includes a plurality of projections formed integrally with the ring and extending inwardly from circumferentially spaced locations on the ring so that said projections of each said contact are cantilevered over the associated hole in the sheet-like body and adapted to resiliently engage a bump lead inserted into the associated hole, said contact material including a bonding surface layer selected from the group consisting of heat-activatable bonding materials;
and
(c) an array of terminals electrically connected to said contacts, whereby a microelectronic component can be connected to a substrate by bonding said terminals to said substrate and superposing said microelectronic element on said body so that bump leads on the component protrude into said holes and are engaged by said resilient contacts.

1 more element

A mounting assembly for mounting and connecting a microelectronic element comprising:

(a) a substrate, said substrate having electrically conductive leads therein;
(b) means defining at least one mounting surface on said substrate including a first sheet-like dielectric connector body overlying a surface of said substrate, said connector body having a first surface facing away from said substrate, a second surface facing toward said substrate and holes open to said mounting surface and extending inwardly toward said substrate, wherein said first connector body is less than about 1 mm thick and wherein said holes extend entirely through said first connector body;
(c) an array of resilient laminar contacts secured to each said mounting surface in registration with said holes so that each said contact extends over one said hole, each said contact being adapted to resiliently engage a bump lead inserted into the associated hole, and to make electrical connection with the bump lead as a result of the resilient engagement, said contacts being electrically connected to said leads in said substrate so that a microelectronic component can be engaged with said mounting assembly and electrically connected thereto by way of resilient engagement between bump leads and said contacts;
and
(d) an electrically conductive via liner in each said hole in said first connector body electrically connecting said contacts to said substrate.

2 more elements

An electronic assembly comprising:

(a) a mounting assembly having a substrate with electrically conductive leads therein, means defining at least one mounting surface on said substrate and holes open to each said mounting surface and extending inwardly toward said substrate, and an array of resilient laminar contacts secured to each said mounting surface in registration with said holes so that each said contact extends over one said hole, said contacts being electrically connected to said leads in said substrate;
and
(b) at least one microelectronic element, each such element having a bottom surface and a plurality of bump leads protruding from such bottom surface, each such bump lead having a side portion, each such microelectronic element being mounted on said mounting assembly, the bottom surface of each such element confronting a mounting surface of the mounting assembly, the bump leads of the element protruding into the holes of such mounting surface, the side portions of the bump leads engaging the contacts at such holes so that the bump leads are electrically connected to the leads of said substrate through said contacts, and said bump leads of at least one said microelectronic element being bonded to said contacts.

A connector for mounting a microelectronic element to a substrate comprising:

(a) a sheetlike body having first and second major surfaces and having a plurality of holes open to said first major surface, said holes being disposed in an array corresponding to an array of bump leads on the microelectronic device to be mounted;
(b) an array of resilient, generally laminar contacts secured to said first major surface of said body in registration with said holes, each said contact including a ring of a sheetlike metallic contact material overlying the first surface of the body and encircling the opening of the associated hole, each said contact further including only one single projection formed integrally with the ring and extending inwardly over one said hole from said first major surface, each said contact being adapted to resiliently engage a bump lead inserted into the associated hole and to make electrical connection with the bump lead as a result of the resilient engagement;
and
(c) an array of terminals electrically connected to said contacts, whereby a microelectronic component can be connected to a substrate by bonding said terminals to said substrate and superposing said microelectronic element on said body so that bump leads on the component protrude into said holes and are engaged by said resilient contacts and thereby electrically connected to them.

1 more element

A connector for mounting a microelectronic element to a substrate comprising:

(a) a sheet-like body having first and second major surfaces and having a plurality of holes open to said first major surface, said holes being disposed in an array corresponding to an array of bump leads on the microelectronic device to be mounted, said holes further being disposed in a regular, grid-like pattern at intervals of less than about 2.5 mm;
(b) an array of resilient, generally laminar contacts secured to said first major surface of said body in registration with said holes so that each said contact extends inwardly over one said hole from said first major surface, each said contact being adapted to resiliently engage a bump lead inserted into the associated hole and to make electrical connection with the bump lead as a result of the resilient engagement;
and
(c) an array of terminals on said second major surface of said body electrically connected to said contacts, whereby a microelectronic component can be connected to a substrate by bonding said terminals to said substrate and superposing said microelectronic element on said body so that bump leads on the component protrude into said holes and are engaged by said resilient contacts and thereby electrically connected to them;
wherein said array of holes and said array of terminals substantially overlap and are rectilinear arrays having row and column directions, and wherein said terminals are offset from said holes in diagonal direct ions, oblique to said row and column directions.

2 more elements

A connector for mounting a microelectronic element to a substrate comprising:

(a) a sheet-like body having first and second major surfaces and having a plurality of holes extending through said body from said first major surface to said second major surface so that each said hole has first-surface and second-surface ends, said holes being disposed in an array corresponding to an array of bump leads on the microelectronic device to be mounted;
(b) an array of resilient, generally laminar contacts secured to said first major surface of said body in registration with said holes so that each said contact extends inwardly over one said hole from said first major surface, each said contact being adapted to resiliently engage a bump lead inserted into the associated hole;
(c) an array of terminals electrically connected to said contacts, each said terminal being disposed on said second major surface adjacent the second-surface end of one said hole;
and
(d) hollow, conductive via liners substantially lining said holes, the contact and terminal associated with each said hole being connected to one another by the via liner lining such hole, each said via liner having a contact support portion flaring outwardly, away from the center of the associated hole at the first-surface end thereof, each said contact including a ring of a sheet-like metallic contact material overlying the contact support portion of the associated via liner and encircling the opening of the associated hole, each said ring being connected to the contact support portion of the associated via liner remote from the hole, each said contact further including at least one projection formed integrally with the ring and extending inwardly therefrom over the hole;
each said contact support having an attachment protruding upwardly, away from said body remote from the associated hole, each said attachment having a locking protrusion overlying the associated ring so as to lock the ring to the contact support;
(e) whereby a microelectronic component can be connected to a substrate by bonding said terminals to said substrate and superposing said microelectronic element on said body so that bump leads on the component protrude into said holes and are engaged by said resilient contacts.

4 more elements

Dependencies are inferred from the claim text.

Microelectronic connector for engaging bump leads

Life of this patent

Microelectronic connector for engaging bump leads

Life of this patent

Abstract

Claims60