Soldering with resilient contacts
AssigneeTessera, Inc.
InventorsJoseph Fjelstad, Thomas H. DiStefano, John W. Smith
Life of this patent
Estimating the term…
Abstract
A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.
Claims15
A method of making an electrical connection comprising the steps of:
- (a) forcibly engaging a first element bearing a mass of a bonding material and a second element bearing a resilient metallic contact so that said contact wipes the surface of said bonding material mass and so that said contact is deformed and bears against the wiped surface;
- and
- (b) bringing the contact and the bonding material mass to an elevated bonding temperature sufficient to soften the bonding material, so that the contact penetrates into the solder mass under the influence of its own resilience;
- and
- (c) cooling the engaged contact and mass.
Dependencies are inferred from the claim text.