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AssigneeTessera, Inc.
InventorsJoseph Fjelstad, John W. Smith, Thomas H. DiStefano, A. Christian Walton
Estimating the term…
A connector for microelectronic elements includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.
A method of making connections to a microelectronic element having bump leads thereon comprising the step of partially engaging the element with a connector having a sheetlike body and having contacts on a first major surface thereof extending over holes in the body so that the first major surface of the connector body is juxtaposed with the microelectronic element, so that the contacts engage the bump leads on the microelectronic element at contact points on each bump lead, so that said bump leads protrude partially into the holes in the connector body and are urged out of said holes by said contacts and so that the bump leads deform the contacts of the connector and are engaged therewith.
A method of making connections to a microelectronic element having bump leads thereon comprising the steps of engaging the element with a connector having a sheetlike body and having contacts on a first major surface thereof extending over holes in the body so that the first major surface of the connector body is juxtaposed with the microelectronic element, so that the bump leads on the microelectronic element protrude into the holes in the connector body and so that the bump leads deform the contacts of the connector and are engaged therewith, and bonding said bump leads to said contacts by activating an electrically conductive bonding material at interfaces between said bump leads and said contacts.
A method of making connections to a microelectronic element having bump leads thereon comprising the steps of:
A method of making connections to a microelectronic element having bump leads thereon, said bump leads including a solid core and a coating of electrically conductive bonding material on the core, the method comprising the steps of:
A method of making connections to a microelectronic element having bump leads thereon comprising the steps of:
Dependencies are inferred from the claim text.