Printed circuit board, manufacturing method thereof, and battery pack including the same
AssigneeLG Energy Solution, Ltd.
InventorsJae Young Jang, Jin Hyun Lee, Min Su Son
Life of this patent
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Abstract
A printed circuit board includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper part of the first copper foil layer. When welding a metal tab onto the solder resist layer, a welding portion that couples the metal tab and the first copper foil layer is formed, and a gap is formed at a portion adjacent to the welding portion.
Claims18
A printed circuit board comprising:
- an inner layer;
- a first insulating layer disposed on an upper part of the inner layer;
- a first copper foil layer disposed on an upper part of the first insulating layer;
- a solder resist layer disposed on an upper part of the first copper foil layer and defining a gap extending from an upper surface of the solder resist layer to a lower surface of the solder resist layer;
- and
- a metal tab disposed on the upper surface of the solder resist layer,
- wherein the metal tab includes a welding portion that extends from the upper surface of the solder resist layer through the gap so as to electrically couples the metal tab and the first copper foil layer.
A manufacturing method of a printed circuit board, the method comprising the steps of:
- disposing a first insulating layer on an upper part of an inner layer;
- disposing a first copper foil layer on an upper part of the first insulating layer;
- disposing a solder resist layer on an upper part of the first copper foil layer;
- and
- welding a metal tab of the solder resist layer such that a welding portion of the metal tab extends from an upper part of the solder resist layer through a gap defined as an opening between the upper part of the solder resist layer and a lower part of the solder resist layer,
- wherein the welding portion electrically couples the metal tab and the first copper foil layer.
Dependencies are inferred from the claim text.