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US 2026/0150189 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorChan Hoon KO
Life of this patent
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Abstract
A printed circuit board includes an insulating layer, and a conductive post disposed on the insulating layer. The conductive post includes a barrier layer, a seed layer disposed on the barrier layer, and a plating layer disposed on the seed layer.
Claims17
A printed circuit board comprising:
- an insulating layer;
- and
- a conductive post disposed on the insulating layer,
- wherein the conductive post includes a barrier layer, a seed layer disposed on the barrier layer, and a plating layer disposed on the seed layer.
1 more element
Dependencies are inferred from the claim text.