H05K 2201/0373
Conductors having a fine structure
Official title: Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
H05K2201/0373 (Conductors having a fine structure) appears on 314 US grants and 254 published applications in this corpus.
Search patents in H05K- Granted patents
- 314
- Published applications
- 254
- Assignees
- 191
- Inventors
- 673
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 8 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 11 | 0 |
| 2000 | 10 | 0 |
| 2001 | 11 | 11 |
| 2002 | 18 | 14 |
| 2003 | 13 | 10 |
| 2004 | 9 | 13 |
| 2005 | 5 | 14 |
| 2006 | 10 | 20 |
| 2007 | 11 | 26 |
| 2008 | 16 | 19 |
| 2009 | 9 | 30 |
| 2010 | 12 | 12 |
| 2011 | 17 | 10 |
| 2012 | 18 | 7 |
| 2013 | 7 | 5 |
| 2014 | 7 | 5 |
| 2015 | 6 | 7 |
| 2016 | 4 | 4 |
| 2017 | 5 | 6 |
| 2018 | 5 | 5 |
| 2019 | 6 | 4 |
| 2020 | 10 | 11 |
| 2021 | 8 | 8 |
| 2022 | 4 | 5 |
| 2023 | 5 | 4 |
| 2024 | 4 | 2 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension2 Dec 2025US 12,490,371 B2
- Interconnection of printed circuit boards with nanowires11 Nov 2025US 12,471,203 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Electronic device3 Dec 2024US 12,160,950 B2Innolux Corporation
- Display apparatus having grooved terminals28 May 2024US 11,997,901 B2Samsung Display Co., Ltd.
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Electronic device20 Feb 2025US 2025/0063653 A1Innolux Corporation
- Circuit board and manufacturing method11 Jul 2024US 2024/0234366 A9NHK Spring Co., Ltd.
- Circuit board and manufacturing method25 Apr 2024US 2024/0136325 A1NHK Spring Co., Ltd.
- Interconnection of printed circuit boards with nanowires5 Oct 2023US 2023/0319976 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Structure for semiconductor package for improving the efficiency of spreading heat241US 5,903,052 AIndustrial Technology Research Institute · 1999
- Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability236US 5,326,428 AMicron Semiconductor, Inc. · 1994