Structure for semiconductor package for improving the efficiency of spreading heat
AssigneeIndustrial Technology Research Institute
InventorsLung-Tai Chen, Ping-Huang Chiang, Yu-Kon Chou, Chien-Chi Chao
Life of this patent
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Abstract
The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.
Claims16
A structure of a semiconductor package, said structure comprising:
- a substrate having a conductive trace and a dielectric tape, wherein a first opening is formed in said substrate, and a plurality of second openings are formed in said dielectric tape;
- a heat spreader attached to said dielectric tape;
- a chip located in said first opening and attached to said heat spreader;
- signal transferring means for connecting said conductive trace and said chip;
- a dielectric supporting member adhered to said conductive trace;
- encapsulating material filling a space between said substrate, said chip, said heat spreader and said dielectric supporting member;
- and
- a plurality of bumps corresponding to said second openings of said dielectric tape, and connected to said conductive trace.
A structure of a semiconductor package, said structure comprising:
- A substrate having a conductive trace and a dielectric tape, wherein a first opening is formed in said substrate, and a plurality of second openings are formed in said dielectric tape;
- a heat spreader attached to said dielectric tape, wherein said heat spreader has a trench pattern formed thereon;
- a chip located in said first opening and attached to said heat spreader;
- signal transferring means for connecting said conductive trace and said chip;
- a dielectric supporting member adhered to said conductive trace;
- encapsulating material filling a space between said substrate, said chip, said heat spreader and said dielectric supporting member;
- and
- a plurality of bumps corresponding to said second openings of said dielectric tape, and connected said conductive trace.
Dependencies are inferred from the claim text.