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US 12,490,371 B2Granted
Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension
OwnerSteve Hsu, Hans Parkinventors
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Abstract
A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, a cavity delimited at a bottom side at least partially by a top side of a stepped metal structure of the at least one electrically conductive layer structure, and a component embedded in the cavity and arranged on the stepped metal structure. A bottom side of the stepped metal structure has a flat surface extending continuously along at least one horizontal direction.
Claims19
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure, at least one electrically insulating layer structure and a cavity delimited at a bottom side at least partially by a top side of a stepped metal structure of the at least one electrically conductive layer structure;
- and
- a component embedded in the cavity and arranged on the stepped metal structure;
- wherein a bottom side of the stepped metal structure has a flat surface extending continuously along at least one horizontal direction;
- wherein the stepped metal structure is an integral metal body;
- wherein the stepped metal structure comprises an upper layer section and a lower layer section, the upper layer section having a different diameter than the lower layer section such that a step is formed at a vertical sidewall of the metal structure at an interface between the upper layer section and the lower layer section,
- wherein a ratio between the diameter of the lower layer section and the diameter of the upper layer section is in a range from 70% to 90%.
4 more elements
A method of manufacturing a component carrier, comprising:
- providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- forming a cavity in the stack being delimited at a bottom side at least partially by a top side of a stepped metal structure of the at least one electrically conductive layer structure,
- wherein a bottom side of the stepped metal structure is formed with a flat surface extending continuously along at least one horizontal direction;
- wherein the stepped metal structure is an integral metal body;
- wherein the stepped metal structure comprises an upper layer section and a lower layer section, the upper layer section having a different diameter than the lower layer section such that a step is formed at a vertical sidewall of the metal structure at an interface between the upper layer section and the lower layer section,
- wherein a ratio between the diameter of the lower layer section and the diameter of the upper layer section is in a range from 70% to 90%;
- arranging a component on the stepped metal structure;
- and
- embedding the component in the cavity.
6 more elements
Dependencies are inferred from the claim text.