Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability

A method of forming a testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof, the method comprising the following steps:

• providing a locally substantially planar outer surface of a first material on a semiconductor substrate;
• providing a layer of second material atop the substantially planar outer surface of first material, the second material being capable of substantially masking the underlying first material;
• patterning and etching the layer of second material to selectively outwardly expose the first material and define a grouping of discrete first material masking blocks, the discrete first material masking blocks of the grouping having respective centers, the respective centers of the grouping being positioned in sufficient proximity to one another such that the centers of the grouping fall within confines of a given single test pad which the apparatus is adapted to electrically engage;
• forming projecting apexes beneath the masking blocks at the masking block centers, the projecting apexes forming a group falling within the confines of the given single test pad of which the apparatus is adapted to electrically engage;
• removing the discrete first material masking blocks from the substrate after the exposing step;
• and
• rendering the projecting apexes electrically conductive.